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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 14 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 ldo regulator bd3650fp-m general description the bd3650fp-m is a low -saturation regulator. this ic has a built-in over-current protection circuit that prevents the destruction of the ic due to output short circuits. it also has a built-in thermal shutdown circuit that protects the ic from thermal damage due to overloading. features ? high output voltage precision: 2% ? low saturation with pdmos output ? built-in over-current protection circuit that prevents destruction of the ic due to output short circuits ? built-in thermal shutdown circuit that protects the ic from thermal damage due to overloading ? low esr capacitor ap plications onboard devices (vehicle equipment, car stereos, satellite navigation systems, etc.) key specifications ? input supply voltage range: 5.6v to 30v ? output voltage: 5.0v (typ) ? output current: 0.3a (max) ? operating temperature range: - 40 c to +125c package w(typ) x d(typ) x h(max) block diagram pin configuration pin descriptions pin no. pin name function 1 vcc power supply pin 2 n.c. no connection pin 3 vo output pin fin gnd gnd top view fin 1 2 vcc n.c. 3 vo gnd vref bandgap reference tsd thermal shut down circuit driver power transistor driver ocp over current protection circuit tsd ocp driver vref vcc vo to252-3 6.50mm x 9.50mm x 2.50mm datashee t datashee t datashee t downloaded from: http:///
2/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 absolute maximum ratings (ta=25 c ) parameter symbol rating unit supply voltage (note 1) v cc -0.3 to +36.0 v power dissipation (note 2) pd 1.2 w operating temperature range topr - 40 to + 125 c storage temperature range tstg - 55 to + 150 c maximum junction temperature tjmax 150 c (note 1) not to exceed pd. (note 2) to252- 3: derate by 9.6mw / c when operating above ta = 25 c and when mounted on glass epoxy board with dimensions =70mm x 70mm x 1.6mm. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit b etween pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as add ing a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=- 40 c to +125 c ) parameter symbol min max unit supply voltage (note 3) v cc 5.6 30.0 v output current i o 0 0.3 a (note 3) the voltage drop (dropout voltage) due to the out put current should be considered. electrical characteristics (unless otherwise specified, ta=- 40 c to +125 c , v cc =10v, i o =0ma) parameter symbol min typ max unit conditions circuit current i cc 0.5 1.0 ma output voltage v o 4.90 5.00 5.10 v i o =200ma dropout voltage v d 0.2 0.4 v v cc =v o x 0.95, i o =200ma ripple rejection r.r. 45 60 db f=120hz , ein= 1v rms , i o =100ma line regulation reg_i 5 35 mv v cc =5.6 v to 30 v load regulation reg_l 10 50 mv i o =10m a to 300ma downloaded from: http:///
3/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 typical performance curves unless otherwise specified, ta=- 40 c to +125c, v cc =10v, i o =0ma 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 250 500 750 1000 1250 1500 output current: io[ma] output voltage: vo[v] - 40 c 25 c 125 c figure 4. output voltage vs output current (load stability) output current: i o [ma] output voltage: v o [v] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 supply volt age: vcc[v] output voltage: vo[v] - 40 c 125 c 25 c figure 2. output voltage vs supply voltage (line regulation , i o =0ma) supply voltage: v cc [v] output voltage: v o [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 supply voltage: vcc[v] circuit current: ib+i feedback_r [ma ] 25 c 125 c - 40 c fi gure 1. circuit current vs supply voltage supply voltage: v cc [v] circuit current: i cc +i feedback_r [ma] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 supply voltage: vcc[v] output voltage: vo[v] - 40 c 125 c 25 c figure 3. output voltage vs supply voltage (line regulation , i o =200ma) supply voltage: v cc [v] output voltage: v o [v] downloaded from: http:///
4/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 typical performance curves C continued unless otherwise specified, ta=- 40 c to +125 c , v cc =10v, i o =0ma 0 50 100 150 200 250 300 0 100 200 300 output current: io[ma] 125 c dropout voltage: ? v d [mv] figure 5. dropout voltage vs output current (v cc =4.75v , i o =0ma to 300ma) output current: i o [ma] - 40 c 25 c 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -40 -20 0 20 40 60 80 100 120 ambient temperature: ta [] output voltage: vo[v] figure 7. output voltage vs ambient temperature ambient temperature: ta [ c] output voltage: v o [v] 0 10 20 30 40 50 60 70 80 100 1000 10000 100000 1000000 frequency: f [hz] ripple rejection: r.r.[db] 125 c 25 c - 40 c figure 6. ripple rejection vs frequency (i o =100ma) frequency: f [hz] ripple rejection: r.r. [db] figure 8. circuit current vs output current (l o =0ma to 300ma) 0.0 0.2 0.4 0.6 0.8 1.0 0 50 100 150 200 250 300 output current: io[ma] circuit current: ib[ma] output current: i o [ma] circuit current: i cc [ma] 125 c 25 c - 40 c downloaded from: http:///
5/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 typical performance curves C continued unless otherwise specified, ta=- 40 c to +125 c , v cc =10v, i o =0ma 0.0 1.0 2.0 3.0 4.0 5.0 6.0 130 140 150 160 170 180 190 ambient temperature: ta[] output voltage: vo[v] figure 9. output voltage vs ambient temperature (thermal shutdown circuit characteristics) ambient temperature: ta [ c] output voltage: v o [v] downloaded from: http:///
6/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 measurement circuit for typical performance curves vcc gnd vo vcc gnd vo vcc gnd vo vcc gnd vo vcc gnd vo vcc gnd vo a vcc gnd vo 2.2 f 4.7 f 2.2 f vcc gnd vo 2.2 f 2.2 f 2.2 f 2.2 f 2.2 f 2.2 f 2.2 f v v 200ma a a 4.75v v 100ma 10v v 10v a 10v v 10v 10v 1vrms 4.7 f 4.7 f 4.7 f 4.7 f 4.7 f 4.7 f 4.7 f 4.7f measurement circuit of figure 1. measurement circuit of figure 2. measurement circuit of figure 3. measurement circuit of figure 4. measurement circuit of figure 5. measurement circuit of figure 6. measurement circuit of figure 7. measurement circuit of figure 8. measurement circuit of figure 9. vcc gnd vo downloaded from: http:///
7/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature: ta () power dissipation: pd (w) 1.20 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature: ta () power dissipation: pd (w) 1.85 3.50 4.80 power dissipation when operating at temperatures above ta=25c, please refer to t he derating factor shown in figure 10 and figure 11 . the ic characteristics are closely related to the temperature at which the ic is used. it is necessary to operate the ic at temperatures below the maximum junction temperature ( tj m ax ). figure 10 and figure 11 show the acceptable loss and derating factor of the to252-3 package. the chip junction temperature (tj) may be quite high even if the ambient temperature ( ta ) is at room temperature (25c). it is recommended to operate the ic at temperatures where power consumption ( pc ) is less than the power dissipation ( pd ) . the calculation method for power consumption pc (w) is as follo ws :( figure 11 ) ? ? cc cc o o cc i v i v v pc ? ? ? ? ? acceptable loss pd pc solving for load current io in order to operate within the accepta ble dissipation, (please refer to figure 8 for i cc .) it is then possible to find the maximum load current (i omax ) with respect to the applied voltage (vcc ) at the time of thermal design. calculation example: when ta=85c , v cc =10v, v o =5v: 5 10 469.2 Q cc o i i ? ? i o 300ma (i cc =0.5ma) please refer to the information above to keep thermal designs within the scope of acceptable lo ss for all operating temperature ranges. the power consumption ( pc ) of the ic when there is a short circuit (short between v o and gnd) is: (please refer to figure 4 for i short .) figure 10 figure 11 (reference data) rohm standard board board size:70mm x 70mm x 1.6mm foil area:7mm x 7mm 2-layer board(back surface copper foil area:15mm x 15mm) 2-layer board(back surface copper foil area:70mm x 70mm) 4-layer board(back surface copper foil area:70mm x 70mm) ja=67.6(c/w) ja=35.7(c/w) ja=26.0(c /w rohm standard board board size 70mm x 70mm x 1.6mm foil area:7mm x 7mm to252- 3: ja=104.2(c/w) figure 11 : ja=26.0c/w to -38.4mw/c 25 c=4.80w to 85 c =2.496w ) ( short cc cc i i v pc ? ? o cc cc cc o v v i v pd i ? ? ? Q power dissipation: pd [w] ambient temperature: ta [ c] power dissipation: pd [w] ambient temperature: ta [ c] where: v cc is the input voltage v o is the output voltage i o is the load current i cc is the circuit current i short is the short current downloaded from: http:///
8/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 i/o equivalent circuit (resistances are typical values.) pin pin 100 k vcc ic vcc vo 83 . 5 k 15 k vo v cc downloaded from: http:///
9/ 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of th e digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, th e two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. th ermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. tjmax : maximum junction temperature=150[c ] , ta : peripheral temperature[c] , ja : thermal resistance of package-ambience[c/w], pd : packag e power dissipation [w], pc : power dissipation [w], v cc : input voltage, v o : output voltage, i o : load, i cc : circuit current package power dissipation : ? ? ? ? ja ta tj w pd ? / max ? ? power dissipation : ? ? ? ? cc cc o o cc i v i v v w pc ? ? ? ? ? 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed un der the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the i c has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors c ompletely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as met al particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
10 / 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 operational notes C continued 10. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasi tic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 12 . example of monolithic ic structure 12. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 13. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. 14. vcc pin insert a capacitor (capacitor 2.2f) between the v cc and gnd pins. the appropriate capacitance value varies b y application. be sure to allow a sufficient margin for input vol tage levels. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
11 / 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 operational notes C continued 15. output pins it is necessary to place capacitors between each output p in and gnd to prevent oscillation on the output. usable capacitance values range from 4.7f to 1000f. ceramic capa citors can be used as long as their esr value is low enough to prevent oscillation (0.001 to 2). abrupt fluctuat ions in input voltage and load conditions may affect the output voltage. output capacitance values should be determined only through sufficient testing of the actual application. 16. in some application or process testing, the voltage on the v cc or other pins may be reversed. if a large capacitor is connected between the output and ground, the current from the charged capacitor can flow to the output and possibl y damage the ic. in order to avoid these problems, limiting output pin capacitance to 100 0f or less and inserting a v cc series countercurrent prevention diode or bypass diode between th e various pins and the v cc is recommended. 17. positive voltage surges on v cc pin a power zener diode should be inserted between vcc and gnd fo r protection against voltage surges of more than 36 v on the vcc pin. 18. negative voltage surges on v cc pin a schottky barrier diode should be inserted between v cc and gnd for protection against voltages lower than gnd on the vcc pin. 19. output protection d iode output loads with large inductive component may cause rev erse current flow to the output pin during startup or shutdown. in such cases, a protection diode should be inse rted at the output to protect the ic. v cc gnd v cc gnd vcc pin bypass diode countercurrent prevention diode (note) measurement circuit c out_ esr vs i o (reference data) v cc =5.6v to 30 v ta =- 40 c to +125c i o = 0a to 0.3a c in =2.2f to 100f c out =4.7f to 100f unstable operating region c out_esr [ ? ] i o [ma] stable operating region cout (above 4.7 f) v cc vo gnd cin (above 2.2 f) esr io(rout) ( above 0.001 ) vcc (5.6 to 30v) downloaded from: http:///
12 / 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 ordering information b d 3 6 5 0 f p - m e 2 part number package fp : to252-3 packaging and forming specification e2: embossed tape and reel marking diagram part number marking package part number 3650 to252-3 reel of 2000 bd3650fp C me2 to252-3 (top view) part number marking lot number 3650 downloaded from: http:///
13 / 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 physical dimension, tape and reel information package name to252-3 downloaded from: http:///
14 / 14 bd3650fp-m datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0g1g0an00420-1-2 20.oct.2014 rev.001 revision history date revision changes 20 .oct.2014 001 new release downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applica tions japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extraordinary environments or conditions, as exemplified bel ow . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or c onditions. if you intend to use our pr oducts under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are e xposed to direct sunlight or dust [c] use of our products in places where the products are ex posed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components , plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wate r or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mo unted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board moun ting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affect product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). whe n used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range d escribed in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with t he rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the products and external components, incl uding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may b e damaged due to electrostatic discharge. please take pro per caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry con dition (e.g. grounding of human body / equipment / solder iron , isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, inc luding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensatio n [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is ind icated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usin g an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. al l information and data including but not limited to applic ation example contained in this document is for reference only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modifie d, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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